microSplatch® uSP410 Chip Antennas

TE Connectivity Linx uSP410 design uses a grounded-line technique to achieve outstanding performance when subject to nearby sources of interference

Image of TE Connectivity Linx microSplatch® uSP410 Chip AntennasTE Connectivity Linx; microSplatch uSP410 surface mount monopole chip antennas target ISM, LoRaWAN®, Sigfox®,  and other low-power, wide-area (LPWA) and remote-control applications.

The uSP410 design uses a grounded-line technique to achieve outstanding performance when subject to nearby sources of interference. uSP410 antennas are available in tape and reel packaging and are designed for reflow-solder mounting directly to a printed circuit board for high-volume applications. Evaluation boards with a pre-mounted antenna and SMA connector are also available.

Features
  • 700 MHz bands: 61% efficiency, peak gain 5.1 dBi, VSWR ≤3.4
  • Compact package (12.7 mm x 9.1 mm x 2.9 mm)
  • Excellent performance with small ground plane (84 mm x 38 mm)
  • Resistant to proximity effect from nearby interferers
  • Direct surface-mount PCB attachment
  • Reflow- or hand-solder assembly
Applications
  • ISM applications
  • LPWA applications
    • LoRaWAN
    • Sigfox
    • Wi-Fi HaLow™
  • Remote controls
  • Smart home networking
  • Sensing and remote monitoring
  • Internet of Things (IoT) devices
Published: 2020-09-29