Gap Pad® TGP 7000ULM
Bergquist’s ultra-low modulus gap-filling material offers exceptional thermal performance at low pressures
Bergquist’s Gap Pad TGP 7000ULM is an extremely soft gap-filling material rated at a thermal conductivity of 7.0 W/m-K that is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation.
Gap Pad TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
- Low assembly stress due to ultra-low modulus (Shore 000 and ASTM D2240)
- Excellent conformability to rough or irregular surfaces
- Thorough wet out at the interface for maximized thermal transfer
- High thermal conductivity of 7.0 W/m-K
- Simplified application and processability; supplied in pre-cut, custom-sized pads with high tack on both sides
- Room-temperature storage
- Telecommunications
- Routers
- Switches
- Base stations
- Optical transceivers
- ASICs
- DSPs
Gap Pad® TGP 7000ULM
| Imagem | Número de peça do fabricante | Descrição | Available Quantity | Preço | Ver detalhes | |
|---|---|---|---|---|---|---|
![]() | ![]() | GPTGP7000ULM-0.020-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 10 - Immediate | $100.02 | Ver detalhes |
![]() | ![]() | GPTGP7000ULM-0.040-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 20 - Immediate | $104.72 | Ver detalhes |
![]() | ![]() | 2474875 | THERM PAD 203.2MMX203.2MM GRAY | 5 - Immediate | $153.82 | Ver detalhes |
![]() | ![]() | GPTGP7000ULM-0.080-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 6 - Immediate | $195.09 | Ver detalhes |
![]() | ![]() | GPTGP7000ULM-0.100-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 44 - Immediate | $165.36 | Ver detalhes |
![]() | ![]() | GPTGP7000ULM-0.125-02-0808 | THERM PAD 203.2MMX203.2MM GRAY | 5 - Immediate | $287.93 | Ver detalhes |



