Gap Pad® TGP 7000ULM

Bergquist’s ultra-low modulus gap-filling material offers exceptional thermal performance at low pressures

Image of Bergquist's Gap Pad® TGP 7000ULMBergquist’s Gap Pad TGP 7000ULM is an extremely soft gap-filling material rated at a thermal conductivity of 7.0 W/m-K that is specially formulated for high-performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation.

Gap Pad TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

Features
  • Low assembly stress due to ultra-low modulus (Shore 000 and ASTM D2240)
  • Excellent conformability to rough or irregular surfaces
  • Thorough wet out at the interface for maximized thermal transfer
  • High thermal conductivity of 7.0 W/m-K
  • Simplified application and processability; supplied in pre-cut, custom-sized pads with high tack on both sides
  • Room-temperature storage
Applications
  • Telecommunications
    • Routers
    • Switches
    • Base stations
  • Optical transceivers
  • ASICs
  • DSPs

Gap Pad® TGP 7000ULM

ImagemNúmero de peça do fabricanteDescriçãoAvailable QuantityPreçoVer detalhes
THERM PAD 203.2MMX203.2MM GRAYGPTGP7000ULM-0.020-02-0808THERM PAD 203.2MMX203.2MM GRAY10 - Immediate$100.02Ver detalhes
THERM PAD 203.2MMX203.2MM GRAYGPTGP7000ULM-0.040-02-0808THERM PAD 203.2MMX203.2MM GRAY20 - Immediate$104.72Ver detalhes
THERM PAD 203.2MMX203.2MM GRAY2474875THERM PAD 203.2MMX203.2MM GRAY5 - Immediate$153.82Ver detalhes
THERM PAD 203.2MMX203.2MM GRAYGPTGP7000ULM-0.080-02-0808THERM PAD 203.2MMX203.2MM GRAY6 - Immediate$195.09Ver detalhes
THERM PAD 203.2MMX203.2MM GRAYGPTGP7000ULM-0.100-02-0808THERM PAD 203.2MMX203.2MM GRAY44 - Immediate$165.36Ver detalhes
THERM PAD 203.2MMX203.2MM GRAYGPTGP7000ULM-0.125-02-0808THERM PAD 203.2MMX203.2MM GRAY5 - Immediate$287.93Ver detalhes
Published: 2020-04-08