Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)
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SMDSWLF.020 1OZ

DigiKey Part Number
SMDSWLF.0201OZ-ND
Manufacturer
Manufacturer Product Number
SMDSWLF.020 1OZ
Description
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)
Datasheet
 Datasheet
Product Attributes
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Category
Melting Point
423 ~ 428°F (217 ~ 220°C)
Manufacturer
Chip Quik Inc.
Flux Type
No-Clean, Water Soluble
Packaging
Spool
Wire Gauge
24 AWG, 25 SWG
Part Status
Active
Process
Lead Free
Type
Wire Solder
Form
Spool, 1 oz (28.35g)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Weight
0.062 lb (28.12 g)
Diameter
0.020" (0.51mm)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
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All prices are in USD
Spool
QuantityUnit PriceExt Price
1$11.48000$11.48
Manufacturers Standard Package