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374324B60023G | |
|---|---|
DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Bulk | Power Dissipation @ Temperature Rise 1.5W @ 50°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Solder Anchor | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 1,983
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Quantity
All prices are in USD
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $3.71000 | $3.71 |
| 10 | $3.28100 | $32.81 |
| 25 | $3.12520 | $78.13 |
| 50 | $3.01220 | $150.61 |
| 216 | $2.78699 | $601.99 |
| 432 | $2.68609 | $1,160.39 |
| 648 | $2.62873 | $1,703.42 |
| 1,080 | $2.55816 | $2,762.81 |
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